This is a kit of two 2G x 64-bit (16GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 1G x 8-bit FBGA components per module. Each module kit supports Intel Extreme Memory Profiles (Intel XMP) 2.0. Total kit capacity is 32GB. Each module has been tested to run at DDR4-3200 at a low latency timing of 16-18-18 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
Power Supply: VDD = 1.2V Typical
VDDQ = 1.2V Typical
VPP = 2.5V Typical
VDDSPD = 2.2V to 3.6V
On-Die termination (ODT)
16 internal banks 4 groups of 4 banks each
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Height 1.661 (42.20mm)
32GB (2 x 8GB)
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